SETAC VarioFlex Pyramid
S3A1U3-B1B-i1
1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP
The Silicom SETAC is a solution that converts a standard server to a network appliance.
- Front system I/O ports
- I/O modules can be replaced without opening the server chassis
- Higher ports density than a standard server
- More reliable solution than a standard PCI Express NIC
SETAC Network appliances are based on standard server with front hot-swap HD. The SETAC Network appliance includes SETAC backplane that replaces a server HD backplane. In a standard server, a HD backplane supports only SAS / SATA technology – Silicom SETAC backplane supports PCI Express and SAS / SATA technology.
Silicom SETAC solution based on Silicom ExpressModule cards, providing widest networking and Bypass solution. The Silicom’ s S3A2U3-A2 is Express x16 Gen 3.0 Host Connector to Two TWINAX Connectors Interface Adapter.
S3A1U3-B1B-i1
1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP
Key features:
- Based on server grade reliability
- Leverage the price / performance / reliability of standard server
- Maximize the I/O ports and interfaces
- Field replaceable - End user can change the configuration without opening of sever chassis
- High quantity of various configurations can be efficiently handled and final configuration can be done just before shipment
- Server and IO module flexibility:
- Based on standard server
- Based on Silicom ExpressModule cards
- Simpler maintenance - Components can be replaced quickly and assuredly
Reliable solution:
- Based on current SATA backplane
- Better than SATA cables
- Better than standard add-in PCI form factor
- Redundant PSU (1+1), low cost model with single PSU
- Standard dimension motherboard (12x13) with next generation NEHALEM CPUs
- Based on embedded solutions –Up to 5 years product life cycle
Host Interface:
- Host Interface standard support PCI Express 3.0 (8Gb/s)
- PCI Express X8 lanes
- Signaling and interface based on PCI-Express EM standard (PCI-SIG) ver. 3.0 (8.0 GT/s)
- Module Width same as standard of 3.5” Hard Disk (101.6mm)
- Module install to 3.5” Hard disk Bay of rack mountable server
- PCI-E EM Backplane replacing HD Backplane
- PCI Express ExpressModule Electromechanical Specification Revision 1.0 (2.0)
- PCI Express External Cabling Specification Revision 1.0 (2.0)
- PCI Express External Cabling Specification 2.0 Revision 0.3 RC2
- PCI Express External Cabling Specification 3.0 Revision 1.0
S3A1U3-B1B-i1
1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP
General Technical Specifications | |
Size: | 3.858" x 1.063" (97.99 mm x 27 mm) |
Voltage: | +12V (Min 11.04V, Max, 12.96V) |
Weight: | 20 gr (0.706 oz ) |
Power Consumption: | 0.48W, 0.04A at 12V: Typical without SETAC module 3.24W, 0.27A at 12V: Typical with SETAC module |
Ports | Up to 8 NIC (SFP/Copper) |
Modules | Up to 1 SETAC Module |
Operating Humidity: | 0%–90%, non-condensing |
Operating Temperature: | 0°C – 50°C (32°F - 122°F) |
Storage Temperature: | -20°C–65°C (-4°F–149°F) |
EMC Certifications: | Class B |
MTBF*: | 821(Years) *According to Telcordia SR-332 Issue 2 Environmental condition – GB (Ground, Fixed, Controlled). Ambient temperature - 40°C |
Connector Specifications | |
Connectors: | (1) PCI-E Connector (1) iPass Connector (1) 0.100" (2.54mm) SL™ Header |
S3A1U3-B1B-i1
1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP
P/N | Description | Notes |
S3A1U3-B1B-i1 | 1U Backplane with Single Gen 3.0 Express Module I/O, Intel S1600JP | Design for Intel S1600JP |
* Power cable must be connected to backplane S3A1U3-B1B-I1.
* Backplane S3A1U3-B1B-I1 works only with S3A1U5-A2 Adapter
1V0