PE310G4DE488BS3 System on NIC Network Adapter

Quad Port 10GbE Broadwell DE In-Line System on NIC Network Adapter

This product has been discontinued – EOL Notification

Silicom’s Broadwell DE System On a NIC (SoNIC) is based on Intel BDW-DE System on a Chip (SoC) Xeon D-1500 Processor.

The Silicom’s BDW-DE SoNIC is targeted for network applications offload, such as multiservice Intrusion detection and prevention (IDS / IPS), unified threat management (UTM) , Deep packet inspection, VPN/Firewall/IDS systems, and any other offload packet processing PCI Express adapter.

PE310G4DE488BS3 System on NIC Network Adapter

Quad Port 10GbE Broadwell DE In-Line System on NIC Network Adapter

Key features:

• Based on Intel® Xeon® SoC Processor D-1500 Product family
• 14nm Intel Haswell Microarchitecture
• SoC One chip Solution, Integrated PCH technology, Intel Ethernet, BGA package
• HW and SW scalability, x86 architecture, 2C – 16C, Up to 45W TDP
• SoNIC mains SKUs
  
  • In-line, Ethernet 2x10G connection to the host server
  • NTB, Non Transparent Bridge PCIe x8G3 connection to the host
• Two channels of 64bit DDR4 memory with ECC, 8GByte, 1600-2400MT/s
• Quad SFP+ 10GbE IO port
• 1GbE Ethernet management port
• Intel QuickAssit® Accelerator ( Coleto Creek 89XX)
• M.2 SSD SATA Card slot, 3 SATA Ports, SPI Flash, 128Mb
• On Board Micro-BMC Controller
• BIOS: Coreboot, Intel Firmware Support Package (FSP)
• OS: Fedora release 22, Kernel 4.1.3 on M2.SSD
• Form Factor, PCIe Standard height Long (12.28” x 4.2”, 312mm x 106.7mm), x8G3, up to 2 slots, (with heatsnik)
• Passive and Active heat sink options

Adapter Features:

• Programmable (x86) Intelligent Quad Port 10GBE PCI Express x8 Gen3.0 NIC
• Front End Packet Processing Offload
• Based BDW-DE SOC, 2- 16 Core Intel@ Xeon (14nm) CPUs
• Xeon Class Server Feaures
• X86, C-programmable, flexible
• SMBUS/NC-SI support
• Ability to SW reboot the device. SW power down/up the system
• On board based management, control fans, monitor temperature
• Remotely manageable
• The best industry performance per watt

Target Applications:

• Network application accelerator offload
• Data Center Accelerator offload
• Security / Compression Accelerator offload
• Storage Accelerator offload

PE310G4DE488BS3 System on NIC Network Adapter

Quad Port 10GbE Broadwell DE In-Line System on NIC Network Adapter

Hardware
Processors
Intel Xeon Processors (embedded in Broadwell-DE SoC)

• 2 to 16 core devices supported
• 45W (and lower) SKUs supported
• 32KB Instruction and data caches, 256KB mid-level cache, and 1.5GB last
• level cache units per CPU core
• 46 bit virtual and physical address spaces per core
• Intel Hyper-Threading Technology supported (2 threads per core)

Processor Memory

• 2 Channels of 64 bit DDR4 memory with ECC
• 1600 to 2400 MT/s memory speeds supported
• Single rank per channel
• Nine 8 bit devices soldered directly to PCB (i.e. memory down) per channel

Network Interfaces
Quad SFP+ 10Gb Ethernet module slots

• Accessible on the front faceplate
• SFP+ MSA SFF-8431 compliant
• Power Level II modules (1.5W max) supported
• Link/activity LED per module slot

Dual 10Gb Ethernet virtual ports (In-line version only)

• 10GBASE-KR interface between controller and Broadwell-DE SoC

1Gb Ethernet Management port

• RJ45 (with integrated LEDs) accessible on front faceplate

Security
Optional Intel QuickAssist Accelerator (Coleto Creek PCH)

• Symmetric Cryptographic Functions: Cipher, Hash, Authenticate, Key Derivation, and Random Number Generation
• Public Key Functions: RSA, Diffie-Helman, Digital Signature, Elliptic Curve Cryptography: ECDSA* and ECDH*, Random Number Generation and Prime Number Testing
• Compression/Decompression: Deflate (Lempel-Ziv 77-Stac)

Storage Interfaces and Devices
M.2 SSD SATA Card slot

• SATA revision 3 6Gb/s rates supported
• Type 2242 –D2-M-x form factor supported SATA Ports
• SATA revision 3 6Gb/s rates supported

SATA revision 3 6Gb/s rates supported

• Two 7 pin right angle data connectors locate along top edge of PCB, one 7 pin right angle data connector located along rear edge of the PCB

SPI Flash, 128Mb

• For storing BIOS/BSP code
• 2x4 pin header and isolation circuitry provided for programming Flash device

Board Management
Two options for on board management: Micro-BMC or a Remote Thermal Monitor/Fan Controller IC

• Board management scheme selected through a jumper on board
• Control and monitoring of two on board fans
• Board thermal monitoring including access to Broadwell-DE SoC internal temperature data
• Voltage monitoring of various rails
• Ability to remotely reboot or power down the board
• Access to boards FRU EEPROM
• Slave SMBus interface for access from the PCIe card interface
• Monitoring of Broadwell-DE SoC power state and thermal status

Micro-BMC

• Low cost design based on the NXP LPC1768 microcontroller
• Access provided through a NC-SI interface to the 1Gb Ethernet controller
• Serial BMC and Intel console ports for debug
• Slave SMBus interface for access from the PCIe card interface

Remote Thermal Monitor and Fan Controller (On Semi NCT7491 or equivalent)

• PECI 3.0 Interface compatible
• On−chip Temperature Sensor

Peripheral Interfaces
3 USB 3.0 ports

• One accessible through the front faceplate
• Two located along rearedge of PCB
• Type-A right angle connectors (faceplate one stands on edge)

Debug Interfaces
2 Extended Debug Ports (XDP)

• One for the CPU cores side of the Broadwell-DE SoC
• One for the PCH side of the Broadwell-DE SoC
• Samtec 60 pin BSH-030-01 series connector for each (not populated in production)

2 virtual serial ports via a USB2.0 Interface

• One serial port for Micro-BMC console and programming
• One serial port for an Intel console interface sourced from the Broadwell-DE SoC (this console port can also be connected to the Micro-BMC to be accessed across the Ethernet management port as selected through a jumper ) 
• Micro-B USB right angle connector located along the top board edge

EMC Certification Requirements

• FCC Part 15-B Class A, Conducted and Radiated Emissions
• CE EN 55022: 1998 Class A, Amendments A1: 2000; A2: 2003, Conducted and Radiated Emissions
• CE EN 55024: 1998 Amendments A1: 2000; A2: 2003, Immunity for ITE Amendment A1:2001
• CE EN 61000-3-2 2000, Class A (Harmonic Current Emissions)
• CE EN 61000-3-3 1995, Amendment A1: 2001 (Voltage Fluctuations and Flicker)
• CE IEC 61000-4-2: 1995 (ESD Discharge, Air 8kV, Contact 4kV)
• CE IEC 61000-4-3: 1995 (Radiated Immunity, 80-1000MHz, 3V/m)
• CE IEC 61000-4-4: 1995 (Immunity to fast electrical transients)
• CE IEC 61000-4-5: 1995 (Immunity to conductive surges)
• CE IEC 61000-4-6: 1996 (Conductive Immunity, 0.15-80MHz, 3Vrms)
• CE IEC 61000-4-11: 1994 (Voltage Dips and short Interruptions)

PE310G4DE488BS3 System on NIC Network Adapter

Quad Port 10GbE Broadwell DE In-Line System on NIC Network Adapter

1V3