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Ruggedized Fanless Compute: Granada

Industrial PC Intel® Xeon® D-1500 Processor based

ruggedized-fanless-compute silicom hq-box

Silicom’s fanless ruggedized systems are based on the Intel® Xeon® D-1500 Processor (Broadwell DE) product line is a highly flexible network edge industrial ruggedized fanless device that brings the agility of x86 Compute and networking in Multi-Access Edge Computing (MEC).

The Granada platform support with PCIE x16 Gen3 full height half length (FHHL) standard PCIE extension with up to 40W available power.

Ruggedized Fanless Compute: Granada

Industrial PC Intel® Xeon® D-1500 Processor based

General Technical Specifications

CPU Intel® Xeon® D-1567 Processor /12C/2.1 GHz/TDP 65W
BIOS UEFI 2.4.1, Secure Boot, Secure Flash
BIOS Flash SPI Flash
Operating System Linux
VMware ESXi 6.5
Memory Two memory channels:
DDR4, DIMM, Up to 64GB, ECC Support, 2133MT/s
Storage M.2 M-Key NVMe, PCIe3.0 x4 (supports for 22110, 2280), Max. Capacity: 4GB
M.2 B-Key SATA3.0 (supports 2280), Max. Capacity: 2GB
M.2 B-Key SATA3.0 (supports 22110, 2280, 2260), Max. Capacity: 2GB
Ethernet ports Up to 4 ports:
2 x10GbE SFP+ (SR,LR,DAC) via X552/Inphy.
2x 1GbE RJ45 via i210-AT.
USB 3.0 4x USB 3.0, USB 2.0, Type-A connector on front panel
USB 2.0 1x USB 2.0, Type-A connector, internal, security
SATA3.0 4x SATA3.0, 7P, internal
NGFF/M.2 M.2 B-Key USB 3.0, USB 2.0, uSIM (supports for 3042), 3.3V card only
M.2 E-Key PCIe2.0, USB2.0 x1 (supports 3042/30)
mPCIe 1x PCIe2.0, USB2.0, support uSIM, half mPCIe
AUDIO 2x Audio IN, Audio OUT
PCIe Expansion Support for x16 Gen3 Card, up to 40W
LTE M.2 LTE Slot (B-Key)
WiFi M.2 WiFi/WiGi/BT Slot (E-Key)
mPCIE WiFi/BT/CAN/RAID
TPM2.0 AES, HMAC, SHA-1, SHA-256, RSA1024, RSA2048,
ECDH, ECC256, ECC-NIST P-256, ECC BN-256, ECC
Buttons Power Button w/ Auto on
LED’s LED 1 (TOP) Power – GREEN, Memory Init -blink RED
LED 2 SATA activity ,GREEN
LED 3 UID,RED
LED 4 N/A
Dimentions 98x195x200mm
Power 13.6V-24V DC (Protection: Reverse polarity, OV, UV, OC)
Weight 3.5kg+add-ons
Power consumption Maximum: TBD
Typical: TBD
The total power consumption of the card depends on user application
Cooling Fanless, conventional air
Operating Temperature -20°C – 60°C
Storage Temperature -40°C – 85°C
Humidity 95%@40°C(non-condensing)
Regulation: CE, FCC, AS/NZS
EN-60950-1, AS/NZS
ETSI EN 300 019-2-5 V3.0.0:2002-12
MTBF* * According to Telcordia SR-332 Issue 2. Environmental condition – GB (Ground, Fixed, and Controlled). Ambient temperature 40°C

Ruggedized Fanless Compute: Granada

Industrial PC Intel® Xeon® D-1500 Processor based

P/N

Description

RMN:

RTN:

90500-0158-G00 Rugged system, D-1567 (12C)/64GB DDR4 w/ECC/2x1GbE/2x10GbE ID1300 ID1300.00