Products

Silicom Edge Networking Solutions

uCPE Small

Intel® Xeon™ D-1500 and Broadcom® Hurricane3 based uCPE

uCPE-Medium

Silicom’s uCPE based on the Intel® Xeon™ D-1500 and Broadcom® Hurricane3 product line is a highly flexible network edge device that brings the agility of modular LAN, WAN, management, and compute to cost-sensitive applications in SD-WAN, CPE, Security, SmallCell, MEC, vRAN, Cell Site, Cloud Edge, Aggregation Router and IoT.

With a new type of modularity x86 and networking switch engine designed specifically for networking application. Silicom uCPE is the ideal platform upon which to deploy next-generation edge applications.

uCPE Small

Intel® Xeon™ D-1500 and Broadcom® Hurricane3 based uCPE

General Technical Specifications

CPU Intel® Xeon™ D-1517 4 Cores, 8 threads Base Freq. 1.6GHz, 6MB Cache, TDP 25W
BIOS Coreboot
BIOS Flash SPI
Operating System Linux
Switch Chips set: Broadcom® Hurricane3 BCM56160
Copper PHY: Embedded CuGPHY, BCM56160
MGMT PHY: Broadcom® B50210S
Memory: 1x16GB DDR4 with ECC, 1 Memory channel
Storage: 256GB /SSD, M2, SATA
Internal Switch: 2x 10GE-KR
External Switch Ports: 10x 1GbE RJ45
4x SFP+
4 of 1GbE supports POE+*
*Total Power POE+ power limit is 65W
Dynamic power load based on actual power consumption
Host Mgmt: 1GbE RJ45 on Management Card, Shared with BMC.
1GbE Between BMC and Switch
USB 3.0: 2xFront, 2x Internal Vertical
Serial Console: RJ45 connector using RS232 signaling
LTE: M.2 Key-B, support 3042 Card. Externally accessible SIM card supported.
Mini PCIe supporting USB2.0/3.0 and externally accessible SIM card.
(optional – not part of BOM)
WiFi: (optional – not part of BOM)
M.2 Expansion M.2 Key B with support up to 30x110mm. Currently used for M.2 Storage
BMC: µBMC
TPM: TPM 2.0 – Compute
TPM2.0 – Module
Power: 90-264VAC input,
12VDC, 125W
54VDC, 65W
Dying Gasp supported on BMC
LED’s: Management card support three tri-color configurable LED’s (red, green, blue)
Other Hardware: Configurable Recessed button (Recommend for Factory reset)
Configurable Large button (Recommend for power)
Form Factor: 1U rackmount Form Factor EIA 19”
Depth 410mm
Expansion / Voice Module PCIe x16: Support for either Voice module or 2/ M4 module. Support for Voice module is connected directly to the CPU board.
In order to support M4 module, needs to install mid plan expansion kit. Mid plan kit is not part of BOM
Cooling: 3 FANs
Sensors/Monitors: Thermal protection
Critical Error Detection
Voltage monitors
Current protection
Operating Temperature: 0°C – 40°C (32°F – 104°F)
Storage: -40°C–65°C (-40°F–149°F)
Regulation: CE, FCC Class A, ROHS requirements.

uCPE Small

Intel® Xeon™ D-1500 and Broadcom® Hurricane3 based uCPE

P/N

Description

Notes

80500-0179-G20 uCPE, 1U,19″,D1517(4C),DDR4/16GB/ECC,2xPS Top level – Shippable kit, including packaging, GA candidate