Edge Networking Solutions
Bilbao uCPE
Intel® Xeon-D-2100, Broadcom® Trident 3-X3 Based
Next-Generation Edge Computing with Silicom Bilbao: The Perfect Solution for Small Cell, MEC, vRAN, and Cloud Edge Applications
Silicom’s Bilbao Edge Compute based on the Intel® Xeon® D-2100 Processor and Broadcom® Trident 3 switch is a high-end Edge Compute appliance offer 10G and 25G Ethernet ports. Silicom Bilbao integrate high speed switch coupled with Xeon processor for high bandwidth connectivity and flexibility that brings the agility of modular LAN, WAN, management, and compute to cost-sensitive applications in SD-WAN, CPE, Security, Small Cell, MEC, vRAN, Cell Site, Cloud Edge, Aggregation Router and IoT.
Deploy Next-Generation Secure Edge Applications with Silicom uCPE Featuring Xeon-D Processor and CoS Queues per Port
The Xeon-D processor and networking switch engine designed specifically for networking application. Switch support flexible Class of Service (CoS) queues per port assure the lowest latency to high priority traffic as well as DoS attack statistics gathering. Silicom uCPE is the ideal platform upon which to deploy next-generation secure edge applications.
Bilbao uCPE
Intel® Xeon-D-2100, Broadcom® Trident 3-X3 Based
General Technical Specifications |
|
| CPU: | Intel® Xeon SKY-D, D-2100 4 Cores, 8 threads Base Freq. 2.2GHz, TDP 60W |
| BIOS: | CoreBoot |
| BIOS Flash: | SPI |
| Operating System: | Linux |
| Switch Chips set: | Broadcom® Trident3-X3 BCM56370 |
| MGMT PHY: | Broadcom® B50210S |
| Memory: | 1x16GB DDR4 with ECC, 1 Memory channel |
| Storage: | 256GB /SSD, M2, SATA |
| Internal Switch: | 1x 10GE-KR 1x PCIe Gen2 |
| External Switch Ports: | 1x100GbE, QSFP28 4x25GbE, SFP28 24x10GbE, SFP+ |
| Host Mgmt: | 1GbE RJ45 on Management Card, Shared with BMC. • 1GbE Between BMC and Switch |
| USB 3.0: | 2xFront, 2x Internal Vertical |
| Serial Console: | RJ45 connector using RS232 signaling |
| M.2 Expansion: | M.2 Key B with support up to 30x110mm. Currently used for M.2 Storage |
| BMC: | μBMC. TI ARM |
| Power: | 90-264VAC input, 12VDC, 550W Dying Gasp supported on BMC Optional redundancy Support FRU hot-swappable |
| LED’s: | Management card support three tri-color configurable LED’s (red, green, blue) |
| Other Hardware: |
Configurable Recessed button (Recommend for Factory reset) Configurable Large button (Recommend for power) |
| Form Factor: | 1U rackmount Form Factor EIA 19” Depth 410mm |
| Weight: | <10Kg |
| Power Consumption: | The total power consumption of the card depends on user application |
| Cooling: | FANs, Design supports up to 5 FANs |
| Sensors/Monitors: | Thermal protection Critical Error Detection Voltage monitors Current protection |
| Operating Temperature: | 0°C – 40°C (32°F – 104°F) |
| Storage: | -40°C–65°C (-40°F–149°F) |
| Operating Altitude: | 10000 ft (3048 m) |
| Regulation: | CE, FCC Class A, ROHS requirements. |
| MTBF*: | >10,000 hours – * According to Telcordia SR-332 Issue 4. Environmental condition – GB (Ground, Fixed, and Controlled). Ambient temperature 40°C |
Bilbao uCPE
Intel® Xeon-D-2100, Broadcom® Trident 3-X3 Based
P/N |
Description |
| 90500-0161-G00 |
uCPE-Bilbao, 1U, 19″, D-2123IT(4C), DDR4 / 16GB / ECC / BCM56370 |
