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SETAC VarioFlex Pyramid

S3A1U3-B1B-i1

1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP

The Silicom SETAC is a solution that converts a standard server to a network appliance.

  • Front system I/O ports
  • I/O modules can be replaced without opening the server chassis
  • Higher ports density than a standard server
  • More reliable solution than a standard PCI Express NIC

SETAC Network appliances are based on standard server with front hot-swap HD. The SETAC Network appliance includes SETAC backplane that replaces a server HD backplane. In a standard server, a HD backplane supports only SAS / SATA technology – Silicom SETAC backplane supports PCI Express and SAS / SATA technology.

Silicom SETAC solution based on Silicom ExpressModule cards, providing widest networking and Bypass solution. The Silicom’ s S3A2U3-A2 is Express x16 Gen 3.0 Host Connector to Two TWINAX Connectors Interface Adapter.

S3A1U3-B1B-i1

1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP

Key features:

  • Based on server grade reliability
  • Leverage the price / performance / reliability of standard server
  • Maximize the I/O ports and interfaces
  • Field replaceable – End user can change the configuration without opening of sever chassis
  • High quantity of various configurations can be efficiently handled and final configuration can be done just before shipment
  • Server and IO module flexibility:
  • Based on standard server
  • Based on Silicom ExpressModule cards
  • Simpler maintenance – Components can be replaced quickly and assuredly

Reliable solution:

  • Based on current SATA backplane
  • Better than SATA cables
  • Better than standard add-in PCI form factor
  • Redundant PSU (1+1), low cost model with single PSU
  • Standard dimension motherboard (12×13) with next generation NEHALEM CPUs
  • Based on embedded solutions –Up to 5 years product life cycle

Host Interface:

  • Host Interface standard support PCI Express 3.0 (8Gb/s)
  • PCI Express X8 lanes
  • Signaling and interface based on PCI-Express EM standard (PCI-SIG) ver. 3.0 (8.0 GT/s)
  • Module Width same as standard of 3.5” Hard Disk (101.6mm)
  • Module install to 3.5” Hard disk Bay of rack mountable server
  • PCI-E EM Backplane replacing HD Backplane
  • PCI Express ExpressModule Electromechanical Specification Revision 1.0 (2.0)
  • PCI Express External Cabling Specification Revision 1.0 (2.0)
  • PCI Express External Cabling Specification 2.0 Revision 0.3 RC2
  • PCI Express External Cabling Specification 3.0 Revision 1.0

S3A1U3-B1B-i1

1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP

General Technical Specifications

Size: 3.858″ x 1.063″ (97.99 mm x 27 mm)
Voltage: +12V (Min 11.04V, Max, 12.96V)
Weight: 20 gr (0.706 oz )
Power Consumption: 0.48W, 0.04A at 12V: Typical without SETAC module
3.24W, 0.27A at 12V: Typical with SETAC module
Ports Up to 8 NIC (SFP/Copper)
Modules Up to 1 SETAC Module
Operating Humidity: 0%–90%, non-condensing
Operating Temperature: 0°C – 50°C (32°F – 122°F)
Storage Temperature: -20°C–65°C (-4°F–149°F)
EMC Certifications: Class B
MTBF*: 821(Years)
*According to Telcordia SR-332 Issue 2
Environmental condition – GB (Ground, Fixed, Controlled). Ambient temperature – 40°C

Connector Specifications

Connectors: (1) PCI-E Connector
(1) iPass Connector
(1) 0.100″ (2.54mm) SL™ Header

S3A1U3-B1B-i1

1U Backplane with Single Gen 3.0 Express Module I/O for Intel S1600JP

P/N

Description

Notes

S3A1U3-B1B-i1 1U Backplane with Single Gen 3.0 Express Module I/O, Intel S1600JP Design for Intel S1600JP

 

* Power cable must be connected to backplane S3A1U3-B1B-I1.

* Backplane S3A1U3-B1B-I1 works only with S3A1U5-A2 Adapter

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