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16-Aug-2010 BREAKTHROUGH DEAL FOR SILICOM’S SETAC: TIER-1 SECURITY LEADER SELECTS SETAC-BASED SOLUTION CREATED BY SILICOM & FORTUNE-100 INDUSTRY GIANT

03-Aug-2010 DATA CENTER CLASS WAN OPTIMIZATION LEADER RAMPS UP ITS BUSINESS WITH SILICOM: BECOMES $1.5 MILLION/YEAR CUSTOMER FOR SILICOM PRODUCTS

26-July-2010 SILICOM REPORTS STRONG Q2 WITH SIGNIFICANT GROWTH ACROSS ALL PARAMETERS

07-July-2010 SILICOM’S SECOND QUARTER 2010 RESULTS RELEASE SCHEDULED FOR JULY 26, 2010

16-June-2010 LEADING EUROPEAN SECURITY SOLUTION MANUFACTURER CHOOSES SILICOM’S SETAC IN HEAD-TO-HEAD COMPETITION OVER HARDWARE APPLIANCES

17-May-2010 SILICOM SERVER ADAPTER ACHIEVES VMWARE-READY™ STATUS

26-Apr-2010 SILICOM REPORTS Q1 FINANCIAL RESULTS

07-Apr-2010 SILICOM’S FIRST QUARTER 2010 RESULTS RELEASE SCHEDULED FOR APRIL 26, 2010

15-Mar-2010 MAXSTAR CHINA CHOOSES SILICOM’S SETAC AS BASIS FOR NEW NETWORK APPLIANCE PLATFORM

22-Feb-2010 SILICOM’s 10Gbps EXTERNAL INTELLIGENT BYPASS SWITCH (IBS) SELECTED BY MAJOR APPLICATION DELIVERY SOLUTION COMPANY

25-Jan-2010 SILICOM REPORTS Q4 REVENUES OF $6.8M, UP 47% COMPARED TO Q3 2009

06-Jan-2010 SILICOM’S FOURTH QUARTER AND FULL YEAR 2009 RESULTS RELEASE SCHEDULED FOR JANUARY 25, 2010

15-Dec-2009 PYRAMID COMPUTER GMBH, LEADING EUROPEAN SUPPLIER OF APPLIANCE SERVERS, CHOOSES SILICOM’S SETAC

16-Nov-2009 SECURITY MARKET GIANT RAMPS UP ITS BUSINESS WITH SILICOM: BECOMES MILLION-DOLLAR-A-YEAR CUSTOMER FOR SILICOM’S 10GB FIBER ADAPTER


 

 

 

 
Untitled Document

 

Silicom’s SETAC (SErver To Appliance Converter)

SETAC Download PDF datasheet


        
 A Better Approach to Building Network Appliances.

   SILICOM’s SETAC combines the advantages of today’s approaches:

Standard Server

  • Function-specific software
     

Hardware Appliance

  • Proprietary design
  • Proprietary add-on modules

PROs: (Supported by SETAC)

  • “Branded” servers with server-grade reliability
  • Stable state-of-the-art technological environment
  • Lower cost per unit
 

CONs:

  • Server look & feel (doesn’t “feel” like an appliance)
  • Inconvenient back connectivity
  • Not modular – can’t  reconfigure without opening the server, therefore can’t be reconfigured in the field
 
 

PROs: (Supported by SETAC)

  • Easy to reconfigure (modular)
  • Looks and feels like an appliance
  • Reliable integration of networking modules

 

 

CONs:

  • No server-grade reliability
  • Time to market lag after each new server chip-set generation
  • Higher cost

 

 

 

    Features of SETAC Appliance:

§    Appliance “look & feel”

§    Front connectivity

§    Server grade reliability

§    Timely support for latest chip sets generations

§    Based on standard servers with front HD trays

§    Based on standard and customized servers chassis

§    Based on Silicom pluggable Express Modules

§    Field replaceable modules – Reseller, Distributor or local branch

can replace Express Module without opening server chassis

§    Backplane supports both Silicom Express Module and hot-swap HD

§    Based on standard PCI-SIG specifications

-          PCI Express – Express Module Electromechanical Specification

Revision 1.0 (2.0)

-          PCI Express External Cabling Specification Revision 1.0 (2.0)

§    PCI Express bit rate of 5Gb/s GEN2 (with consideration for future bit rate)

§    Targeted to Nehalem-based platforms

§    Currently available with Supermicro and Dell platforms. Roadmap includes IBM, Intel and Tyan platforms as well

§    Based on embedded solutions – up to 7 year product life cycle

§    Patent pending

 

Examples of Technical Specifications

 

1U Pyramid

3U

2U

1U

Format Factors

Customized Pyramid chassis

Supermicro –

CSE-835TQ-R800B

Supermicro –

CSE-825MTQ-R700LPB

Supermicro –

SCE813MTQ-520CB

Chassis

Supermicro - X8STE

Single Intel® Core™ i7 and Intel® Xeon® 5500/3500 series processors

Supermicro - X8DTH-iF

Support Two Intel® 5500 Series (LGA 1366) processors,

Intel 5520 and ICH10R chipset, including: two IOH-36D hubs

Supermicro - X8DTi

Support Two Intel® 5500 Series (LGA 1366) processors,

Intel 5520 and ICH10R chipset

Supermicro – X8SIL

Single Intel® Xeon® 3400 series processors (LGA 1156)

Main Board

 

 

6 x 240-pin, DDR3 SDRAM DIMM sockets with support for unbuffered ECC or non ECC 1333/1066/800 MHz memory

12 x 240-pin DIMM sockets supports up to 96 GB of RDIMM or 24 GB of UDIMM DDR3 1333/1066/800 MHz Memory

12 x  240-pin DIMM sockets supports up to 96 GB of DDR3 Registered ECC Memory

4x 240-pin, DDR3 SDRAM DIMM with support

for up to 16GB of UDIMM or up to 32GB of RDIMM

Memory (ECC/DDR3 1333/1066/800 MHz memory only)

Main Memory

 

 

Intel Dual-channel 82574L Gigabit (10/100/1000 Mb/s) Ethernet Controller

Intel 82576EB dual-port Gigabit  (10/100/1000 Mb/s) Ethernet controllers

Intel 82576EB dual-port Gigabit  (10/100/1000 Mb/s) Ethernet controllers

Intel Dual-channel 82574L Gigabit (10/100/1000 Mb/s) Ethernet Controller

LAN Features (LOM)

 

Supports up to 4 x SETAC bays

Supports 6 x SETAC bays

Supports 3 x SETAC bays

Supports 2 SETAC + 2 HD bays

Expansion 

Copper :

Up to 24 1Gb Ethernet

Up to 16 bypass 1Gb Ethernet 

 
Fiber
:

Up to 16 1Gb Ethernet 

Up to 8 10G Ethernet

Up to 8 Bypass  10Gb  Ethernet

Copper:

Up to 36 1Gb Ethernet

Up to 24 bypass 1Gb Ethernet

Fiber :

Up to 24 1Gb Ethernet

Up to 12 10Gb Ethernet

Up to 12 10Gb Bypass Ethernet

Copper:

Up to 18 1Gb Ethernet

Up to 12 bypass 1Gb Ethernet

Fiber :

Up to 12 1Gb Ethernet

Up to 6 10Gb Ethernet

Up to 6 10Gb Bypass Ethernet

Copper :

Up to 12 1Gb Ethernet

Up to 18 bypass 1Gb Ethernet 

Fiber :

Up to 8 1Gb Ethernet 

Up to 4 10G Ethernet

Up to 4 Bypass  10Gb  Ethernet

I/O Interface Front

 

 

Supports up to 4 x SETAC bays

Supports 6 x SETAC bays

Supports 3 x SETAC bays

Supports 4 x SETAC bays

Expansion

Copper :

Up to 24 1Gb Ethernet

Up to 16 bypass 1Gb Ethernet 

Fiber :

Up to 16 1Gb Ethernet 

Up to 8 10G Ethernet

Up to 8 Bypass  10Gb  Ethernet

Copper:

Up to 36 1Gb Ethernet

Up to 24 bypass 1Gb Ethernet

Fiber :

Up to 24 1Gb Ethernet

Up to 12 10Gb Ethernet

Up to 12 10Gb Bypass Ethernet

Copper:

Up to 18 1Gb Ethernet

Up to 12 bypass 1Gb Ethernet 

Fiber :

Up to 12 1Gb Ethernet

Up to 6 10Gb Ethernet

Up to 6 10Gb Bypass Ethernet

Copper :

Up to 24 1Gb Ethernet

Up to 16 bypass 1Gb Ethernet

Fiber :

Up to 16 1Gb Ethernet 

Up to 8 10G Ethernet

Up to 8 Bypass  10Gb  Ethernet

I/O Interface Front

 

 

Supports 400W AC power supply

 

Supports 800W (1 + 1) Redundant AC-DC high-efficiency power supply w/ PFC

Supports 700W (1 + 1) Redundant AC-DC high-efficiency power supply w/ PFC

500W cold-swap PS

Power Input

 

 

Height   1.7"   (43mm)

Width    17.2" (437mm)

Depth    25 "   (635mm)

Height   5.2"   (132mm)

Width    17.7" (450mm)

Depth    25.6" (650mm)

Height   3.5"   (89mm)

Width    17.2" (437mm)

Depth    17.7" (450mm)

Height  1.7"   (43mm)

Width   17.2" (437mm)

Depth   25.6" (503mm)

Chassis Dimensions

 

 

 

 

 

 

Quad Port Fiber SFP 82576

Quad Port Copper Bypass 82576

Dual Port Fiber Bypass 82576

6 Port Copper 82576

Dual Port 10 Gigabit Fiber Bypass 82599

Dual Port 10 Gigabit SFP 82599

 

                 

 

* Additional modules are available

 

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